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MBD-H11DSI

4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs (Board revision 2.x required)
3.Expansion slots:
 2 PCI-E 3.0 x16
 3 PCI-E 3.0 x8
 M.2 Interface: 1 SATA/PCI-E 3.0 x2
 (Platform with EPYC 7002 processor
 only supports PCI-E type M.2 module)
 M.2 Form Factor: 2280, 22110
 M.2 Key: M-key
4.10 SATA3, 1 M.2, 2 SATA DOM
5.Dual Gigabit Ethernet LAN Ports
6.ASPEED AST2500 BMC graphics
7.Up to 2 USB 3.0 ports
Up to 4 USB 2.0 ports
8.8 4-pin PWM Fan & Speed control

EMAIL
Specifications 

Product SKUs

MBD-H11DSiH11DSi
MBD-H11DSi-BH11DSi (Bulk Pack)


Physical Stats

Form FactorE-ATX
Dimensions12" x 13.05" (30.5cm x 33.1cm)


Processor/Chipset

CPUDual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3
Up to 240W TDP
CoresUp to 32 Cores
Up to 64 Cores (Board revision 2.x required)
ChipsetSystem on Chip


System Memory

Memory Capacity16 DIMM sockets
Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required)
8-channel memory bus
Memory TypeDDR4 2666 MHz Registered ECC, 288-pin gold-plated DIMMs
DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs (Board revision 2.x required)
DIMM Sizes8GB, 16GB, 32GB, 64GB, 128GB, 256GB* (*Board revision 2.x required)
Memory Voltage1.2V
Error DetectionCorrects single-bit errors
Detects double-bit errors (using ECC memory)


On-Board Devices

SATASATA3 (6 Gbps)
IPMISupport for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2500 BMC
Network Controllers2 1GbE LAN via Intel® i350-AM21
1 Realtek RTL8211E PHY (dedicated IPMI)
VGAASPEED AST2500 BMC


Input / Output

SATA10 SATA3 (6 Gbps) ports
LAN2 RJ45 Gigabit Ethernet LAN ports
1 RJ45 Dedicated IPMI LAN port
USB2 USB 3.0 ports (rear)
4 USB 2.0 ports (2 rear + 2 via header)
VGA1 VGA port
Others1 COM port (rear)
2 SATA DOM power connector
1 TPM 2.0 header


Expansion Slots

PCI-Express3 PCI-E 3.0 x8
2 PCI-E 3.0 x16

M.2Interface: 1 SATA/PCI-E 3.0 x2
(Platform with EPYC 7002 processor only supports PCI-E type M.2 module)
Form factor: 2280, 22110
Key: M-key

Chassis ( Optimized for H11DSi )

2USC213AC-R1K23LPB
SC216BE1C4-R1K23LPB
SC825TQC-R802LPB
SC826BE1C4-R1K23LPB
SC829HE1C4-R1K62LPB
3USC836BE1C-R1K23B
4USC745BAC-R1K28B2
SC846BE1C-R1K23B


System BIOS

BIOS TypeAMI 128Mb SPI Flash EEPROM
BIOS FeaturesPlug and Play (PnP)
DMI 2.3
PCI 2.2
ACPI 5.1
USB Keyboard Support
SMBIOS 3.1.1


Management

SoftwareSuper
 Doctor 5
Watch Dog
NMI
SUM
IPMI 2.0, KVM with dedicated LAN
Power ConfigurationsACPI Power Management
Power-on mode control for AC power loss recovery


PC Health Monitoring

CPUMonitors CPU Core Voltages, +1.5V, +1.8V, +12V +5V, +5V standby
CPU switching voltage regulator
Supports system management utility
VBAT
FANUp to 8-fan status tachometer monitoring
Up to eight 4-pin fan headers
Dual Cooling Zone
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
TemperatureMonitoring for CPU and chassis environment
CPU Thermal Trip Support
Thermal control for 8x Fan connectors
I2C Temperature Sensing Logic
LEDCPU / System Overheat LED
Other FeaturesChassis Intrusion Detection
Chassis Intrusion Header
UID
Operating Environment / Compliance
Environmental SpecificationsOperating Temperature:
10°C to 35°C (50°F to 95°F)
Non-operating Temperature:
-40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)
Parts List 

Bulk Pack List


Part Number
H11DSIMBD-H11DSI-B
I/O CableCBL-0044L
I/O ShieldMCP-260-00042-0N

Optional Parts List


Part Number
I/O CableCBL-0097L-03
TPM security moduleAOM-TPM-9655V
AOM-TPM-9665V


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Contact: zeke.zhou

Phone: +8618274592588

E-mail: zero@zarecloud.com

Add: 3205B, Seg Square, No.1002, Huaqiang North Road, Fuqiang Community, Huaqiang North Street, Futian District, Shenzhen City, China