12" x 10"
Key Features
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 140W TDP, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
2 PCIe 3.0 x16,
3 PCIe 3.0 x8,
1 PCIe 3.0 x4 (in x8 slot)
M.2 Interface: 1 SATA/PCIe 3.0 x4
M.2 Form Factor: 2260, 2280


联系人: Aven HUANG
手机: +8618206142192
地址: 12A Chengtou Keji Dasha,Longhua District, Shenzhen,Guangdong,CHINA